XC5VLX110-1FFG1760C
vs
XC5VLX110-1FFG676I
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA-1760
|
BGA-676
|
| Pin Count |
1760
|
676
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A001.A.7.A
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Combinatorial Delay of a CLB-Max |
0.9 ns
|
0.9 ns
|
| JESD-30 Code |
S-PBGA-B1760
|
S-PBGA-B676
|
| JESD-609 Code |
e1
|
e1
|
| Length |
42.5 mm
|
27 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
8640
|
8640
|
| Number of Inputs |
800
|
440
|
| Number of Logic Cells |
110592
|
110592
|
| Number of Outputs |
800
|
440
|
| Number of Terminals |
1760
|
676
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
8640 CLBS
|
8640 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1760,42X42,40
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.5 mm
|
3 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
42.5 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
72 Weeks
|
|
|
|
Compare XC5VLX110-1FFG1760C with alternatives
Compare XC5VLX110-1FFG676I with alternatives