XC5VLX110-1FFG676I vs XC5VLX110-1FF1760I feature comparison

XC5VLX110-1FFG676I AMD Xilinx

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XC5VLX110-1FF1760I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-676 BGA, BGA1760,42X42,40
Pin Count 676 1760
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 72 Weeks
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B1760
JESD-609 Code e1 e0
Length 27 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8640 8640
Number of Inputs 440 800
Number of Logic Cells 110592 110592
Number of Outputs 440 800
Number of Terminals 676 1760
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8640 CLBS 8640 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA1760,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 42.5 mm
Base Number Matches 1 1

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