XC4VLX15-10FFG676IS2 vs XC4VLX15-10FFG676I feature comparison

XC4VLX15-10FFG676IS2 AMD Xilinx

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XC4VLX15-10FFG676I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Moisture Sensitivity Level 4 4
Peak Reflow Temperature (Cel) 250 250
Base Number Matches 1 1
Part Package Code BGA
Package Description BGA, BGA676,26X26,40
Pin Count 676
ECCN Code 3A991.D
Clock Frequency-Max 1028 MHz
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Length 27 mm
Number of CLBs 1536
Number of Inputs 320
Number of Logic Cells 13824
Number of Outputs 320
Number of Terminals 676
Organization 1536 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

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