XC4VLX15-10FFG676I vs XC4VLX15-10FF668IS2 feature comparison

XC4VLX15-10FFG676I AMD Xilinx

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XC4VLX15-10FF668IS2 AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description BGA, BGA676,26X26,40
Pin Count 676
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1028 MHz 1028 MHz
JESD-30 Code S-PBGA-B676 S-PBGA-B668
JESD-609 Code e1 e0
Length 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1536
Number of Inputs 320 320
Number of Logic Cells 13824 13824
Number of Outputs 320 320
Number of Terminals 676 668
Organization 1536 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA668,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm
Base Number Matches 1 1

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