XC4VFX60-10FFG672I
vs
XQ4VFX60-10EFG672M
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
|
Package Description |
LEAD FREE, FBGA-672
|
,
|
Pin Count |
672
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
52 Weeks
|
|
Clock Frequency-Max |
1028 MHz
|
|
JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
JESD-609 Code |
e1
|
|
Length |
27 mm
|
|
Moisture Sensitivity Level |
4
|
|
Number of CLBs |
6320
|
|
Number of Inputs |
352
|
|
Number of Logic Cells |
56880
|
|
Number of Outputs |
352
|
|
Number of Terminals |
672
|
672
|
Organization |
6320 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA672,26X26,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3 mm
|
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
27 mm
|
|
Base Number Matches |
2
|
1
|
Combinatorial Delay of a CLB-Max |
|
0.78 ns
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Temperature Grade |
|
MILITARY
|
|
|
|
Compare XC4VFX60-10FFG672I with alternatives
Compare XQ4VFX60-10EFG672M with alternatives