XC4VFX60-10FFG672I vs XQ4VFX60-10EFG672M feature comparison

XC4VFX60-10FFG672I AMD Xilinx

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XQ4VFX60-10EFG672M AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-672 ,
Pin Count 672
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 1028 MHz
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 4
Number of CLBs 6320
Number of Inputs 352
Number of Logic Cells 56880
Number of Outputs 352
Number of Terminals 672 672
Organization 6320 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
Base Number Matches 2 1
Combinatorial Delay of a CLB-Max 0.78 ns
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Temperature Grade MILITARY

Compare XC4VFX60-10FFG672I with alternatives

Compare XQ4VFX60-10EFG672M with alternatives