XC4VFX60-10FFG672I
vs
XC4VFX60-12FF672I
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, FBGA-672
27 X 27 MM, 1 MM PITCH, MS-034-AAL-1, FBGA-672
Pin Count
672
672
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
Clock Frequency-Max
1028 MHz
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
4
4
Number of CLBs
6320
6320
Number of Inputs
352
Number of Logic Cells
56880
Number of Outputs
352
Number of Terminals
672
672
Organization
6320 CLBS
6320 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
2.65 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
2
2
Compare XC4VFX60-10FFG672I with alternatives
Compare XC4VFX60-12FF672I with alternatives