XC4VFX60-10FF1152CS1 vs XC4VFX60-11FFG1152I feature comparison

XC4VFX60-10FF1152CS1 AMD Xilinx

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XC4VFX60-11FFG1152I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA1152,34X34,40 LEAD FREE, FBGA-1152
Pin Count 1152 1152
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1028 MHz 1181 MHz
Combinatorial Delay of a CLB-Max 0.2 ns
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of Inputs 576 576
Number of Logic Cells 56880 56880
Number of Outputs 576 576
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 6320 CLBS 6320 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 2
ECCN Code 3A991.D
Number of CLBs 6320

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Compare XC4VFX60-11FFG1152I with alternatives