XC4VFX100-12FFG1152C vs XC4VFX100-12FF1152I feature comparison

XC4VFX100-12FFG1152C AMD Xilinx

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XC4VFX100-12FF1152I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LEAD FREE, FBGA-1152 35 X 35 MM, 1 MM PITCH, MS-034-AAR-1, FBGA-1152
Pin Count 1152 1152
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1181 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 10544 10544
Number of Inputs 576
Number of Logic Cells 94896
Number of Outputs 576
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 10544 CLBS 10544 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 1

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Compare XC4VFX100-12FF1152I with alternatives