XC4VFX100-12FF1152I vs XC4VFX100-12FF1152C feature comparison

XC4VFX100-12FF1152I AMD Xilinx

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XC4VFX100-12FF1152C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034-AAR-1, FBGA-1152 FBGA-1152
Pin Count 1152 1152
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 10544 10544
Number of Terminals 1152 1152
Organization 10544 CLBS 10544 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 2
ECCN Code 3A991.D
Clock Frequency-Max 1181 MHz
Number of Inputs 576
Number of Logic Cells 94896
Number of Outputs 576
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC4VFX100-12FF1152I with alternatives

Compare XC4VFX100-12FF1152C with alternatives