XC4085XL-3BGG560I vs XC4062XL-08CBG560C feature comparison

XC4085XL-3BGG560I AMD Xilinx

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XC4062XL-08CBG560C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA560,33X33,50
Pin Count 560 560
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 85000 LOGIC GATES MAX USABLE 62000 LOGIC GATES
Clock Frequency-Max 166 MHz 238 MHz
Combinatorial Delay of a CLB-Max 1.6 ns 1.1 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3
Number of CLBs 3136 2304
Number of Equivalent Gates 55000 40000
Number of Terminals 560 560
Organization 3136 CLBS, 55000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Number of Inputs 384
Number of Logic Cells 5472
Number of Outputs 384
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Equivalence Code BGA560,33X33,50
Temperature Grade OTHER

Compare XC4085XL-3BGG560I with alternatives

Compare XC4062XL-08CBG560C with alternatives