XC4062XL-08CBG560C vs XC4052XL-2BG560I feature comparison

XC4062XL-08CBG560C AMD Xilinx

Buy Now Datasheet

XC4052XL-2BG560I AMD Xilinx

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, BGA560,33X33,50 PLASTIC, BGA-560
Pin Count 560 560
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 62000 LOGIC GATES MAX USABLE 52000 LOGIC GATES
Clock Frequency-Max 238 MHz 179 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.5 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
Length 42.5 mm 42.5 mm
Number of CLBs 2304 1936
Number of Equivalent Gates 40000 33000
Number of Inputs 384 352
Number of Logic Cells 5472 1936
Number of Outputs 384 352
Number of Terminals 560 560
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 2304 CLBS, 40000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Terminal Finish Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) 30

Compare XC4062XL-08CBG560C with alternatives

Compare XC4052XL-2BG560I with alternatives