XC4062XLA-08BG352I vs XC4085XLA-08BG352I feature comparison

XC4062XLA-08BG352I AMD Xilinx

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XC4085XLA-08BG352I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 PLASTIC, BGA-352
Pin Count 352 352
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.2 12.2
Average Weight (mg) 13565.2 13565.2
CO2e (mg) 165494.832 165494.832
Total Weight 7142 7142
Category CO2 Kg 12.2 12.2
CO2 87132.4 87132.4
Compliance Temperature Grade Industrial: -40C to +100C Industrial: -40C to +100C
Candidate List Date 2024-01-23 2024-01-23
SVHC Over MCV 7439-92-1 7439-92-1
CAS Accounted for Wt 92 92
CA Prop 65 Presence YES YES
CA Prop 65 CAS Numbers 7440-02-0, 7439-92-1 7440-02-0, 7439-92-1
Conflict Mineral Status DRC Conflict Free Undeterminable DRC Conflict Free Undeterminable
Conflict Mineral Status Source FMD FMD
Additional Feature CAN ALSO USE 130000 GATES CAN ALSO USE 180000 GATES
Clock Frequency-Max 263 MHz 263 MHz
Combinatorial Delay of a CLB-Max 1 ns 1 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 3136
Number of Equivalent Gates 40000 55000
Number of Inputs 289 289
Number of Logic Cells 5472 7448
Number of Outputs 289 289
Number of Terminals 352 352
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2304 CLBS, 40000 GATES 3136 CLBS, 55000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Pbfree Code No

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