XC4085XLA-08BG352I
vs
XC4062XLA-09BG352I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-352
PLASTIC, BGA-352
Pin Count
352
352
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO USE 180000 GATES
CAN ALSO USE 130000 GATES
Clock Frequency-Max
263 MHz
227 MHz
Combinatorial Delay of a CLB-Max
1 ns
1.1 ns
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3136
2304
Number of Equivalent Gates
55000
40000
Number of Inputs
289
289
Number of Logic Cells
7448
5472
Number of Outputs
289
289
Number of Terminals
352
352
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
3136 CLBS, 55000 GATES
2304 CLBS, 40000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Compare XC4085XLA-08BG352I with alternatives
Compare XC4062XLA-09BG352I with alternatives