XC4062XL-08CBG560C vs XC4085XL-1BGG560I feature comparison

XC4062XL-08CBG560C AMD Xilinx

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XC4085XL-1BGG560I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, BGA560,33X33,50 LBGA,
Pin Count 560 560
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 62000 LOGIC GATES MAX USABLE 85000 LOGIC GATES
Clock Frequency-Max 238 MHz 200 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.3 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
Length 42.5 mm 42.5 mm
Number of CLBs 2304 3136
Number of Equivalent Gates 40000 55000
Number of Inputs 384
Number of Logic Cells 5472
Number of Outputs 384
Number of Terminals 560 560
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 2304 CLBS, 40000 GATES 3136 CLBS, 55000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC4085XL-1BGG560I with alternatives