XC4052XLA-9BGG432C vs XC4062XL-09BGG432C feature comparison

XC4052XLA-9BGG432C AMD Xilinx

Buy Now Datasheet

XC4062XL-09BGG432C AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description HLBGA, LBGA,
Pin Count 432
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 227 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.2 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e1 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 2304
Number of Equivalent Gates 33000 40000
Number of Inputs 352 352
Number of Outputs 352 352
Number of Terminals 432 432
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1936 CLBS, 33000 GATES 2304 CLBS, 40000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HLBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 40 mm 40 mm
Base Number Matches 1 1
Pbfree Code Yes
Additional Feature TYPICAL GATES = 40000-130000

Compare XC4052XLA-9BGG432C with alternatives

Compare XC4062XL-09BGG432C with alternatives