XC4062XL-09BGG432C vs XC4052XL-3BGG432C feature comparison

XC4062XL-09BGG432C AMD Xilinx

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XC4052XL-3BGG432C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Package Description LBGA, LBGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TYPICAL GATES = 40000-130000 MAX USABLE 52000 LOGIC GATES
Clock Frequency-Max 217 MHz 166 MHz
Combinatorial Delay of a CLB-Max 1.2 ns 1.6 ns
JESD-30 Code S-PBGA-B432 S-PBGA-B432
JESD-609 Code e1 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2304 1936
Number of Equivalent Gates 40000 33000
Number of Inputs 352 352
Number of Outputs 352 352
Number of Terminals 432 432
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2304 CLBS, 40000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA432,31X31,50 BGA432,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 432

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