XC4052XLA-09BG352I vs XC4052XLA-09BG352C feature comparison

XC4052XLA-09BG352I AMD Xilinx

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XC4052XLA-09BG352C Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XILINX INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 LBGA,
Pin Count 352 352
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Additional Feature CAN ALSO USE 100000 GATES CAN ALSO USE 100000 GATES
Clock Frequency-Max 227 MHz 227 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.1 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 1936
Number of Equivalent Gates 33000 33000
Number of Inputs 289
Number of Logic Cells 4598
Number of Outputs 289
Number of Terminals 352 352
Organization 1936 CLBS, 33000 GATES 1936 CLBS, 33000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 2
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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