XC3S700A-4FGG484I
vs
XC3S1000-4FGG456I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-484
23 X 23 MM, LEAD FREE, FBGA-456
Pin Count
484
456
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
35 Weeks
35 Weeks
Clock Frequency-Max
667 MHz
630 MHz
Combinatorial Delay of a CLB-Max
0.71 ns
0.61 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B456
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1472
1920
Number of Equivalent Gates
700000
1000000
Number of Inputs
372
333
Number of Logic Cells
13248
17280
Number of Outputs
288
333
Number of Terminals
484
456
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
1472 CLBS, 700000 GATES
1920 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA456,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Compare XC3S700A-4FGG484I with alternatives
Compare XC3S1000-4FGG456I with alternatives