XC3S5000-5FG676C vs XC3S4000-5FGG676C feature comparison

XC3S5000-5FG676C AMD Xilinx

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XC3S4000-5FGG676C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, FBGA-676 27 X 27 MM, LEAD FREE, FBGA-676
Pin Count 676 676
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 40 Weeks 30 Weeks
Clock Frequency-Max 725 MHz 725 MHz
Combinatorial Delay of a CLB-Max 0.53 ns 0.53 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 8320 6912
Number of Equivalent Gates 5000000 4000000
Number of Inputs 489 489
Number of Logic Cells 74880 62208
Number of Outputs 489 489
Number of Terminals 676 676
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 8320 CLBS, 5000000 GATES 6912 CLBS, 4000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3S5000-5FG676C with alternatives

Compare XC3S4000-5FGG676C with alternatives