XC3S5000-5FG676C
vs
XC3S2000-5FGG676C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, FBGA-676
27 X 27 MM, LEAD FREE, FBGA-676
Pin Count
676
676
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
40 Weeks
52 Weeks
Clock Frequency-Max
725 MHz
725 MHz
Combinatorial Delay of a CLB-Max
0.53 ns
0.53 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
8320
5120
Number of Equivalent Gates
5000000
2000000
Number of Inputs
489
489
Number of Logic Cells
74880
46080
Number of Outputs
489
489
Number of Terminals
676
676
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
8320 CLBS, 5000000 GATES
5120 CLBS, 2000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
2
2
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare XC3S5000-5FG676C with alternatives
Compare XC3S2000-5FGG676C with alternatives