XC3S50-4PQG208C vs XC3S50-4PQ208I feature comparison

XC3S50-4PQG208C AMD Xilinx

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XC3S50-4PQ208I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP QFP
Package Description 30.60 X 30.60 MM, LEAD FREE, PLASTIC, QFP-208 30.60 X 30.60 MM, PLASTIC, QFP-208
Pin Count 208 208
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e3 e4
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 192 192
Number of Equivalent Gates 50000 50000
Number of Inputs 124 124
Number of Logic Cells 1728 1728
Number of Outputs 124 124
Number of Terminals 208 208
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 192 CLBS, 50000 GATES 192 CLBS, 50000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 28 mm 28 mm
Base Number Matches 1 1

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