XC3S2000-4FG900I
vs
XC2V4000-4FF1152I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
31 X 31 MM, FBGA-900
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count
900
1152
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A001.A.7.A
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
23 Weeks
Clock Frequency-Max
630 MHz
650 MHz
Combinatorial Delay of a CLB-Max
0.61 ns
0.44 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B1152
JESD-609 Code
e0
e0
Length
31 mm
35 mm
Moisture Sensitivity Level
3
4
Number of CLBs
5120
5760
Number of Equivalent Gates
2000000
4000000
Number of Inputs
565
824
Number of Logic Cells
46080
51840
Number of Outputs
565
824
Number of Terminals
900
1152
Organization
5120 CLBS, 2000000 GATES
5760 CLBS, 4000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
3.4 mm
Supply Voltage-Max
1.26 V
1.575 V
Supply Voltage-Min
1.14 V
1.425 V
Supply Voltage-Nom
1.2 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
35 mm
Base Number Matches
1
1
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Compare XC3S2000-4FG900I with alternatives
Compare XC2V4000-4FF1152I with alternatives