XC3S1400AN-5FGG676C vs XC3S1400A-5FGG676C feature comparison

XC3S1400AN-5FGG676C AMD Xilinx

Buy Now Datasheet

XC3S1400A-5FGG676C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-676 FBGA-676
Pin Count 676 676
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 770 MHz 770 MHz
Combinatorial Delay of a CLB-Max 0.62 ns 0.62 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 1400000 1400000
Number of Inputs 502 502
Number of Logic Cells 25344 25344
Number of Outputs 408 408
Number of Terminals 676 676
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2816 CLBS, 1400000 GATES 2816 CLBS, 1400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 2 2

Compare XC3S1400AN-5FGG676C with alternatives

Compare XC3S1400A-5FGG676C with alternatives