XC3S1400AN-5FGG676C
vs
XC3S1400A-4FGG676I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
FBGA-676
FBGA-676
Pin Count
676
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Factory Lead Time
52 Weeks
Clock Frequency-Max
770 MHz
667 MHz
Combinatorial Delay of a CLB-Max
0.62 ns
0.71 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e1
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2816
2816
Number of Equivalent Gates
1400000
1400000
Number of Inputs
502
502
Number of Logic Cells
25344
25344
Number of Outputs
408
408
Number of Terminals
676
676
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
2816 CLBS, 1400000 GATES
2816 CLBS, 1400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
2
2
Samacsys Manufacturer
AMD
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