XC3164A-3PC84I vs XC3064-50PC84C feature comparison

XC3164A-3PC84I AMD Xilinx

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XC3064-50PC84C AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX USABLE 4500 LOGIC GATES MAX 70 I/OS; 688 FLIP-FLOPS
Clock Frequency-Max 270 MHz 50 MHz
Combinatorial Delay of a CLB-Max 2.7 ns 14 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
Length 29.3116 mm 29.3116 mm
Moisture Sensitivity Level 3 3
Number of CLBs 224 224
Number of Equivalent Gates 3500 6400
Number of Inputs 70 70
Number of Logic Cells 224 224
Number of Outputs 70 70
Number of Terminals 84 84
Operating Temperature-Max 100 °C 70 °C
Operating Temperature-Min -40 °C
Organization 224 CLBS, 3500 GATES 224 CLBS, 6400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.699 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 3
Temperature Grade COMMERCIAL

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Compare XC3064-50PC84C with alternatives