XC2V1000-4BGG575C
vs
XQR2V1000-4BG575N
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
31 X 31 MM, 1.27 MM PITCH, LEAD FREE, MS-034BAN-1, BGA-575
1.27 MM PITCH, PLASTIC, MS-034BAN-1, BGA-575
Pin Count
575
575
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.D
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
650 MHz
650 MHz
Combinatorial Delay of a CLB-Max
0.44 ns
0.44 ns
JESD-30 Code
S-PBGA-B575
S-PBGA-B575
JESD-609 Code
e1
e0
Length
31 mm
31 mm
Number of CLBs
1280
1280
Number of Equivalent Gates
1000000
1000000
Number of Inputs
328
328
Number of Logic Cells
11520
11520
Number of Outputs
328
328
Number of Terminals
575
575
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1280 CLBS, 1000000 GATES
1280 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA575,24X24,50
BGA575,24X24,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
MILITARY
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
31 mm
31 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
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