XC2S100-5FGG256Q vs XC2S100-5FG256I feature comparison

XC2S100-5FGG256Q AMD Xilinx

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XC2S100-5FG256I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA,
Pin Count 256 256
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 600 600
Number of Equivalent Gates 100000 100000
Number of Terminals 256 256
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 600 CLBS, 100000 GATES 600 CLBS, 100000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 1 1
ECCN Code EAR99
Factory Lead Time 52 Weeks
Clock Frequency-Max 263 MHz
Combinatorial Delay of a CLB-Max 0.7 ns
Number of Inputs 180
Number of Logic Cells 2700
Number of Outputs 176
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

Compare XC2S100-5FGG256Q with alternatives

Compare XC2S100-5FG256I with alternatives