XC2C384-6FG324C vs XC2C384-10TQG144I feature comparison

XC2C384-6FG324C AMD Xilinx

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XC2C384-10TQG144I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA QFP
Package Description 23 X 23 MM, 1 MM PITCH, FBGA-324 20 X 20 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144
Pin Count 324 144
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
In-System Programmable YES YES
JESD-30 Code S-PBGA-B324 S-PQFP-G144
JESD-609 Code e0 e3
JTAG BST YES YES
Length 23 mm 20 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 240 118
Number of Macro Cells 384 384
Number of Terminals 324 144
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 240 I/O 0 DEDICATED INPUTS, 118 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFQFP
Package Equivalence Code BGA324,22X22,40 QFP144,.87SQ,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 6 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.5 mm 1.6 mm
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 20 mm
Base Number Matches 1 1
Pbfree Code Yes
Factory Lead Time 30 Weeks
Architecture PLA-TYPE
Clock Frequency-Max 83 MHz
Number of Inputs 118
Number of Outputs 118

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Compare XC2C384-10TQG144I with alternatives