XC18V512VQ44C0799 vs KM23C4100AFP2-20 feature comparison

XC18V512VQ44C0799 AMD Xilinx

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KM23C4100AFP2-20 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC SAMSUNG SEMICONDUCTOR INC
Part Package Code QFP QFP
Package Description TQFP, WQFP, TQFP44,.6SQ,32
Pin Count 44 44
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.1.B.2 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Access Time-Max 15 ns 200 ns
JESD-30 Code S-PQFP-G44 S-CQFP-G44
Length 10 mm 10 mm
Memory Density 524288 bit 4194304 bit
Memory IC Type CONFIGURATION MEMORY MASK ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 65536 words 262144 words
Number of Words Code 64000 256000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX8 256K16
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TQFP WQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE FLATPACK, WINDOW
Parallel/Serial PARALLEL/SERIAL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Alternate Memory Width 8
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code TQFP44,.6SQ,32
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Terminal Finish TIN LEAD

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