XC1765EPDG8I vs XC1765-CD8M feature comparison

XC1765EPDG8I AMD Xilinx

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XC1765-CD8M AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDIP-T8 R-CDIP-T8
JESD-609 Code e3 e0
Length 9.3599 mm 13.208 mm
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 64KX1 64KX1
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 3.4036 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Clock Frequency-Max (fCLK) 2.5 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Standby Current-Max 0.0005 A
Supply Current-Max 0.01 mA

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