XC1765EPDG8I
vs
5962-9471701MPA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
JESD-609 Code
e3
e0
Length
9.3599 mm
10.16 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
64KX1
64KX1
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
250
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5974 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
5 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP8,.3
Screening Level
MIL-STD-883
Standby Current-Max
0.0015 A
Supply Current-Max
0.01 mA
Compare XC1765EPDG8I with alternatives
Compare 5962-9471701MPA with alternatives