XC17256EPCG20I vs XC1701PCG20C feature comparison

XC17256EPCG20I AMD Xilinx

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XC1701PCG20C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QLCC QLCC
Package Description QCCJ, QCCJ,
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e3 e3
Length 8.9662 mm 8.9662 mm
Memory Density 262144 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX1 1MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 30
Width 8.9662 mm 8.9662 mm
Base Number Matches 1 1

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