XC1701PCG20C
vs
XC17256ELPCG20C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
QLCC
QLCC
Package Description
QCCJ,
QCCJ,
Pin Count
20
20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
JESD-609 Code
e3
e3
Length
8.9662 mm
8.9662 mm
Memory Density
1048576 bit
262144 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
1048576 words
262144 words
Number of Words Code
1000000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX1
256KX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
4.572 mm
Supply Voltage-Max (Vsup)
5.25 V
3.6 V
Supply Voltage-Min (Vsup)
4.75 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
40
Width
8.9662 mm
8.9662 mm
Base Number Matches
1
1
Compare XC1701PCG20C with alternatives
Compare XC17256ELPCG20C with alternatives