XC17256ELPC20C vs XC17V01PC20I feature comparison

XC17256ELPC20C Rochester Electronics LLC

Buy Now Datasheet

XC17V01PC20I AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 PLASTIC, LCC-20
Pin Count 20 20
Reach Compliance Code unknown not_compliant
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e0
Length 8.9662 mm 8.9662 mm
Memory Density 262144 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX1 1MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 225
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8.9662 mm 8.9662 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 15 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code LDCC20,.4SQ
Standby Current-Max 0.001 A
Supply Current-Max 0.015 mA

Compare XC17V01PC20I with alternatives