XQ1704LCCG44B vs XCF02SVO20C feature comparison

XQ1704LCCG44B AMD Xilinx

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XCF02SVO20C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC TSSOP
Package Description QCCJ, PLASTIC, TSSOP-20
Pin Count 44 20
Reach Compliance Code compliant not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code S-CQCC-J44 R-PDSO-G20
JESD-609 Code e3 e0
Length 16.51 mm 6.5024 mm
Memory Density 4194304 bit 2097152 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 44 20
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 4MX1 2MX1
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCJ TSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Seated Height-Max 4.826 mm 1.19 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD DUAL
Width 16.51 mm 4.4 mm
Base Number Matches 1 1
Additional Feature IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Data Retention Time-Min 20
Endurance 20000 Write/Erase Cycles
Moisture Sensitivity Level 3
Package Equivalence Code TSSOP20,.25
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.001 A
Supply Current-Max 0.01 mA
Technology CMOS
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE

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