XAM5718AABCXEA
vs
MCIMX6X4EVM10AB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
FREESCALE SEMICONDUCTOR INC
Package Description
FBGA,
MABGA-529
Reach Compliance Code
compliant
compliant
Date Of Intro
2016-05-14
Address Bus Width
16
Boundary Scan
YES
Clock Frequency-Max
38.4 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
NO
JESD-30 Code
S-PBGA-B760
S-PBGA-B529
JESD-609 Code
e1
e1
Length
23 mm
19 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
3
Number of Terminals
760
529
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
250
Seated Height-Max
2.96 mm
1.5 mm
Speed
1500 MHz
Supply Voltage-Max
1.2 V
1.5 V
Supply Voltage-Min
1.11 V
1.35 V
Supply Voltage-Nom
1.15 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
19 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
SoC
Base Number Matches
1
2
Pbfree Code
ECCN Code
5A992
HTS Code
8542.31.00.01
Package Equivalence Code
BGA529,23X23,32
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