XAM5718AABCXEA
vs
MCIMX6U7CVM08AC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
FREESCALE SEMICONDUCTOR INC
Package Description
FBGA,
21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MABGA-624
Reach Compliance Code
compliant
compliant
Date Of Intro
2016-05-14
Address Bus Width
16
26
Boundary Scan
YES
YES
Clock Frequency-Max
38.4 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PBGA-B760
S-PBGA-B624
JESD-609 Code
e1
e1
Length
23 mm
21 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
760
624
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
250
Seated Height-Max
2.96 mm
1.5 mm
Speed
1500 MHz
800 MHz
Supply Voltage-Max
1.2 V
Supply Voltage-Min
1.11 V
Supply Voltage-Nom
1.15 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Pbfree Code
ECCN Code
5A992
HTS Code
8542.31.00.01
Bit Size
32
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