XAM3359ZCZ50
vs
XAM3359ZCZD50
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
LFBGA,
Pin Count
324
324
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
26 MHz
26 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Low Power Mode
YES
YES
Number of Terminals
324
324
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max
1.4 mm
1.4 mm
Speed
500 MHz
500 MHz
Supply Voltage-Max
1.15 V
1.15 V
Supply Voltage-Min
1.06 V
1.06 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare XAM3359ZCZ50 with alternatives
Compare XAM3359ZCZD50 with alternatives