XAM3359ZCZ50
vs
STA1080HOCTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
STMICROELECTRONICS
Part Package Code
BGA
Package Description
LFBGA,
LFBGA,
Pin Count
324
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
26 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B361
JESD-609 Code
e1
Length
15 mm
16 mm
Low Power Mode
YES
NO
Number of Terminals
324
361
Operating Temperature-Max
90 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max
1.4 mm
1.7 mm
Speed
500 MHz
533 MHz
Supply Voltage-Max
1.15 V
1.26 V
Supply Voltage-Min
1.06 V
1.14 V
Supply Voltage-Nom
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
16 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare XAM3359ZCZ50 with alternatives
Compare STA1080HOCTR with alternatives