XA6SLX9-3CPG196I vs XC6SLX9-3CPG196C feature comparison

XA6SLX9-3CPG196I AMD Xilinx

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XC6SLX9-3CPG196C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 62.5 MHz 862 MHz
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1 e8
Moisture Sensitivity Level 3 3
Number of Inputs 106 100
Number of Logic Cells 9152 9152
Number of Outputs 106 100
Number of Terminals 196 196
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TFBGA
Package Equivalence Code BGA196,14X14,20 BGA196,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Package Description 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
Pin Count 196
ECCN Code EAR99
Combinatorial Delay of a CLB-Max 0.21 ns
Length 8 mm
Number of CLBs 715
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 715 CLBS
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Technology CMOS
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm

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Compare XC6SLX9-3CPG196C with alternatives