XA6SLX9-3CPG196I vs XC6SLX9-3CPG196I feature comparison

XA6SLX9-3CPG196I AMD

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XC6SLX9-3CPG196I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Reach Compliance Code compliant compliant
Clock Frequency-Max 862 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.21 ns
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1 e8
Length 8 mm 8 mm
Moisture Sensitivity Level 3 3
Number of Inputs 106 106
Number of Logic Cells 9152 9152
Number of Outputs 106 106
Number of Terminals 196 196
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 715 CLBS 715 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TFBGA
Package Equivalence Code BGA196,14X14,20 BGA196,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100; TS 16949
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Package Description 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
Pin Count 196
ECCN Code EAR99
HTS Code 8542.39.00.01
Number of CLBs 715
Peak Reflow Temperature (Cel) 260
Technology CMOS
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) 30

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