XA6SLX25-3CSG324Q vs XC6SLX25-3CSG324C feature comparison

XA6SLX25-3CSG324Q AMD Xilinx

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XC6SLX25-3CSG324C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 62.5 MHz 862 MHz
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Moisture Sensitivity Level 3 3
Number of Inputs 226 226
Number of Logic Cells 24051 24051
Number of Outputs 226 226
Number of Terminals 324 324
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Package Description 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Pin Count 324
Combinatorial Delay of a CLB-Max 0.21 ns
Length 15 mm
Number of CLBs 1879
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1879 CLBS
Seated Height-Max 1.5 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Technology CMOS
Temperature Grade OTHER
Width 15 mm

Compare XA6SLX25-3CSG324Q with alternatives

Compare XC6SLX25-3CSG324C with alternatives