X88C64DMB vs F356635P feature comparison

X88C64DMB Xicor Inc

Buy Now Datasheet

F356635P Fairchild Semiconductor Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC FAIRCHILD SEMICONDUCTOR CORP
Package Description HERMETIC SEALED, CERDIP-24 DIP,
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 200 ns
Additional Feature PAGE WRITE
Command User Interface NO
Data Polling NO
JESD-30 Code R-GDIP-T24 R-PDIP-T24
JESD-609 Code e0
Length 32.07 mm 31.75 mm
Memory Density 65536 bit 4194304 bit
Memory IC Type EEPROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 512KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Page Size 32 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.72 mm 4.698 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Toggle Bit YES
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 24
ECCN Code EAR99
HTS Code 8542.32.00.71
Output Characteristics 3-STATE

Compare X88C64DMB with alternatives

Compare F356635P with alternatives