X86C64PMB
vs
5962-8751512LA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
XICOR INC
|
QP SEMICONDUCTOR INC
|
| Package Description |
DIP,
|
0.300 INCH, WINDOWED, CERDIP-24
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
120 ns
|
25 ns
|
| Additional Feature |
PAGE WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION=100 YEARS
|
POWER SWITCHED PROM
|
| Data Retention Time-Min |
100
|
|
| Endurance |
10000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDIP-T24
|
R-GDIP-T24
|
| Length |
31.685 mm
|
31.877 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
UVPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
WDIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE, WINDOW
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.87 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.61
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare X86C64PMB with alternatives
Compare 5962-8751512LA with alternatives