X84128ZE-2.5
vs
X25138ZI-2.7
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IC MICROSYSTEMS SDN BHD
|
XICOR INC
|
| Part Package Code |
BGA
|
|
| Package Description |
VBGA,
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Clock Frequency-Max (fCLK) |
5 MHz
|
3.3 MHz
|
| JESD-30 Code |
R-XBGA-B8
|
R-PBGA-B8
|
| JESD-609 Code |
e0
|
|
| Length |
6.046 mm
|
|
| Memory Density |
131072 bit
|
131072 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
16384 words
|
16384 words
|
| Number of Words Code |
16000
|
16000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Organization |
16KX8
|
16KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VBGA
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.62 mm
|
|
| Serial Bus Type |
3-WIRE
|
SPI
|
| Supply Current-Max |
0.002 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.5 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
1.982 mm
|
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare X84128ZE-2.5 with alternatives
Compare X25138ZI-2.7 with alternatives