Findchips: Compare X76F400HIG vs X76F400WI

X76F400HIG vs X76F400WI feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes	No
Rohs Code	Yes	No
Part Life Cycle Code	Contact Manufacturer	Contact Manufacturer
Ihs Manufacturer	IC MICROSYSTEMS SDN BHD	IC MICROSYSTEMS SDN BHD
Part Package Code	DIE	WAFER
Package Description	DIE,	DIE,
Reach Compliance Code	unknown	unknown
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.51	8542.32.00.51
Additional Feature	DATA RETENTION = 100 YEARS	DATA RETENTION = 100 YEARS
Data Retention Time-Min	100	100
JESD-30 Code	X-XUUC-N	X-XUUC-N
Memory Density	4096 bit	4096 bit
Memory IC Type	FLASH	FLASH
Memory Width	8	8
Number of Functions	1	1
Number of Words	512 words	512 words
Number of Words Code	512	512
Operating Mode	SYNCHRONOUS	SYNCHRONOUS
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	512X8	512X8
Package Body Material	UNSPECIFIED	UNSPECIFIED
Package Code	DIE	DIE
Package Shape	UNSPECIFIED	UNSPECIFIED
Package Style	UNCASED CHIP	UNCASED CHIP
Parallel/Serial	SERIAL	SERIAL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Programming Voltage	5 V	5 V
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	UPPER
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Type	NOR TYPE	NOR TYPE
Write Cycle Time-Max (tWC)	10 ms	10 ms
Base Number Matches	1	2
JESD-609 Code		e0
Terminal Finish		TIN LEAD
	Memory » Flash Memories	Memory » Flash Memories