X76F400WI
vs
X76F041HEG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Contact Manufacturer
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
IC MICROSYSTEMS SDN BHD
Part Package Code
WAFER
DIE
Package Description
DIE,
ROHS COMPLIANT, DIE
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
DATA RETENTION = 100 YEARS
PASS SECURE FLASH
Data Retention Time-Min
100
JESD-30 Code
X-XUUC-N
X-XUUC-N
JESD-609 Code
e0
Memory Density
4096 bit
4096 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
512X8
512X8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
2
1
Clock Frequency-Max (fCLK)
1 MHz
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare X76F400WI with alternatives
Compare X76F041HEG with alternatives