X76F400WI-2.5
vs
X76F400WG-2.5
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
XICOR INC
IC MICROSYSTEMS SDN BHD
Package Description
WAFER
DIE,
Reach Compliance Code
unknown
unknown
Clock Frequency-Max (fCLK)
1 MHz
JESD-30 Code
X-XUUC-N
X-XUUC-N
Memory Density
4096 bit
4096 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512X8
512X8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
WAFER
ECCN Code
EAR99
HTS Code
8542.32.00.51
Additional Feature
DATA RETENTION = 100 YEARS
Data Retention Time-Min
100
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare X76F400WI-2.5 with alternatives
Compare X76F400WG-2.5 with alternatives