X76F400HG vs X76F041HG-3 feature comparison

X76F400HG IC Microsystems Sdn Bhd

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X76F041HG-3 IC Microsystems Sdn Bhd

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Contact Manufacturer
Ihs Manufacturer IC MICROSYSTEMS SDN BHD IC MICROSYSTEMS SDN BHD
Part Package Code DIE DIE
Package Description DIE, ROHS COMPLIANT, DIE
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature DATA RETENTION = 100 YEARS PASS SECURE FLASH
Data Retention Time-Min 100
JESD-30 Code X-XUUC-N X-XUUC-N
Memory Density 4096 bit 4096 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512X8 512X8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape UNSPECIFIED UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programming Voltage 5 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Type NOR TYPE NOR TYPE
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 1 MHz

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