X76F200W-2
vs
SLE4432C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
SIEMENS A G
Part Package Code
WAFER
DIE
Package Description
DIE,
DIE,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
X-XUUC-N
R-XUUC-N
JESD-609 Code
e0
Memory Density
2048 bit
2048 bit
Memory IC Type
FLASH
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
80 °C
Operating Temperature-Min
-35 °C
Organization
256X8
256X8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.2 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
Write Cycle Time-Max (tWC)
10 ms
Base Number Matches
1
2
Additional Feature
DATA RETENTION => 10 YEARS; ENDURANCE =>100K WRITE/ERASE CYCLES
Data Retention Time-Min
10
Endurance
100000 Write/Erase Cycles
Serial Bus Type
I2C
Compare X76F200W-2 with alternatives
Compare SLE4432C with alternatives